A semiconductor device package includes a plurality of semiconductor memory devices
whose address input terminals are commonly connected to the external address input
pins of the package, and an internal address generating device for using an address
signal applied through at least one of the address input pins to select one of
the memory devices to perform a read/write data operation. Only the selected memory
device is enabled to perform the read/write operation on a memory cell corresponding
to the received address signal. The external pin configuration of the semiconductor
device package is compatible with a conventional memory board layout.
