In a bottom gate type semiconductor device made of a semiconductor layer with
crystal structure, source/drain regions are constructed by a lamination layer structure
including a first conductive layer (n+ layer), a second conductive layer
(n-; layer) having resistance higher than the first conductive layer,
and an intrinsic or substantially intrinsic semiconductor layer (i layer). At this
time, the n-; layer acts as LDD region, and the i layer acts as an offset
region is a film thickness direction.