A fastener assembly including a base consisting of a pair of motherboard snaps on a first end and a hollow shaft on a second end, the motherboard snaps to be inserted through an aperture of a motherboard. The hollow shaft is inserted through an aperture of a heat sink clip. The base further includes a pair of grooves on an exterior of the shaft. The assembly further including a cap consisting of a hollow interior, an integrated post attached to a base of the interior, and a pair of cantilever snaps. The cap is fitted over the exterior surface of the hollow shaft of the base to secure the clip between the base and the cap. The integrated post of the cap to be inserted into the hollow shaft of the base to deflect the motherboard snaps outward on an opposite side of the motherboard aperture to secure the assembly with the motherboard. The cantilever snaps to be positioned in the grooves of the shaft of the base to secure the cap with the base.