An electronic apparatus includes a first assembly and a second assembly. Each assembly has a circuit board defining a front side and a back side, a set of connectors mounted to the front side of that circuit board, and a heat sink disposed over the front side of that circuit board. The heat sink is configured to provide cooling to that assembly. The electronic apparatus further includes a coupling mechanism that couples the first and second assemblies together in a substantially parallel manner. The sets of connectors of the assemblies form a connection interface to concurrently connect the first and second assemblies to a backplane.