Test substrates used to test semiconductor fabrication tools are reclaimed by reading from a database the process steps performed on each test substrate and selecting a reclamation process from a plurality of reclamation processes, for reclaiming each test substrate. Information identifying the processes performed on each test substrate and the reclamation process selected for each test substrate, may be stored in a test substrate history database. Each test substrate is sorted and placed into a group of test substrates having a common reclamation process assigned to the test substrates of the group. The bins in which the sorted test substrates are stored are each labeled with identifying information including basic or detailed information on the reclamation process selected for the test substrates stored in the bin. The information may also include a list of the test substrates stored in each bin. Information identifying the test substrates stored in each bin and the reclamation process selected for those test substrates may also be stored in a database for those bins. The sorted test substrates may be removed from the bins by a reclamation operator in an automated system in which an identification code is read from each test substrate by a suitable reader. The reclamation process assigned to each test substrate can be read from a database supplied to the operator to verify which reclamation process was assigned to each test substrate prior to reclaiming the test substrate.