An insulating sheet which connects a semiconductor chip and a wiring substrate
is provided between the semiconductor chip and the wiring substrate. The insulating
sheet has windows therethrough at positions corresponding to those of connection
pads of the wiring substrate and has leads, one end of each of the leads being
fixed on the sheet and the other end of each of the leads protruding from the opposite
surface of the sheet through a window. Each of solder balls of the semiconductor
chip is connected to the fixed one end of one of the leads, and each of the connection
pads is connected to the other end of each of the leads to electrically connect
the semiconductor chip and the wiring substrate.