The invention is an apparatus for handling of a disklike member especially for handling of a wafer, comprising robot means adapted to carry out at least an angular motion in a defined moving plane, and end-effector means for holding the disklike member, wherein said apparatus comprises a wrist member operatively interconnecting said robot means with said end-effect means; wherein said wrist member and said robot provide an inclining motion of said disklike member by a combined movement of said end-effector about a first axis in plane with and symmetrically dividing said surface, and about a second axis perpendicular to said moving plane.