A metal-to-metal antifuse having a lower metal electrode, a lower thin adhesion promoting layer disposed over the lower metal electrode, an amorphous carbon antifuse material layer disposed over the thin adhesion promoting layer, an upper thin adhesion promoting layer disposed over said antifuse material layer, and an upper metal electrode. The thin adhesion promoting layers are about 2 angstroms to 20 angstroms in thickness, and are from a material selected from the group comprising Si_xC_y and Si_xN_y. The ratio of x to y in Si_xC_y is in a range of about 1+/-0.4, and the ratio of x to y in Si_xN_y is in a range of about 0.75+/-0.225.