A semiconductor device includes: an element isolation region in a semiconductor substrate; an active area in the semiconductor substrate; an interlayer insulation film on the element isolation region and the active area; an opening to which the element isolation region, the active area and a boundary therebetween are exposed; a glue layer in the opening; and a conductor on the glue layer. The element isolation region isolates the active area in the semiconductor substrate, and the active area overlaps a top surface of the isolation region.