A radiator plate rapid cooling apparatus includes a base deck and radiation fins located thereabove formed integrally by extrusion, forging or soldering. The base deck is located at the bottom end of the radiator plate and has passages formed by machining that house a capillary device placed therein or integrally formed by extrusion to become a double-layer passage loop. After being vacuumized, the loop is filled with a liquid or gas heat dissipation medium to the amount of 10% to 70% of the internal volume capacity of the passages. The base deck is in contact with a contact surface of a computer heat generating element. Heat may be concentrated on a heat absorption end of the base deck, transferred to the radiation fins, and be dispelled by a fan to improve heat dissipation.