An integrated heat dissipating device has a heat sink, a first set of fins, a
second set of fins and at least one heat pipe. The heat sink has a thermal conductive
block embedded therein and a through hole exposing the thermal conductive block
from a top surface of the heat sink. The first set of fins has a plurality of horizontally
extending fins stacked with each other along a vertical direction over the heat
sink. The second set of fins is integrated by a plurality of vertically extending
fins arranged in a curved shape between the heat sink and the first set of fins.
The heat pipe has a vertical extension across the first set of fins and a horizontal
extension underneath a bottom of the first set of fins. The horizontal extension
is inserted into the through hole in contact with the thermal conductive block.