A semiconductor chip having an exposed metal terminating pad thereover, and a
separate
substrate having a corresponding exposed metal bump thereover are provided. A conducting
polymer plug is formed over the exposed metal terminating pad. A conforming interface
layer is formed over the conducting polymer plug. The conducting polymer plug of
the semiconductor chip is aligned with the corresponding metal bump. The conforming
interface layer over the conducting polymer plug is mated with the corresponding
metal bump. The conforming interface layer is thermally decomposed, adhering and
permanently attaching the conducting polymer plug with the corresponding metal
bump. Methods of forming and patterning a nickel carbonyl layer are also disclosed.