An apparatus and method for handling microelectronic workpiece containers. In one embodiment, the apparatus includes a container support having one or more support elements positioned to carry a microelectronic workpiece container. A container securement device is positioned at least proximate to the support element(s). A contact surface of the securement device is moved in a first direction so that it contacts or is positioned to contact a surface of the workpiece container. The contact surface is then moved in a second direction different that the first direction to clamp the workpiece container against the support element(s).