A heat dissipation device is disclosed for dissipating the heat produced by electronic components (16) of an electronic control device. The electronic control device includes a circuit board (14), a resin protective case (10), and a metal actuator block (20). The electronic components are mounted on the circuit board. The protective case confines the circuit board within a thermally restrictive environment. The actuator block is mounted to the outside of the protective case. The heat dissipation device includes a heat conduction path (24, 30) that serves to thermally conduct the heat produced by the electronic components from the interior of the protective case to the actuator block.