A semiconductor package such as a bumped chip carrier (BCC) package has projections extending from a lower surface of a resin encapsulant. Each projection has a concave depression formed thereon. By reflowing a solder layer, external terminals are formed to cover the projections. An interface between the terminals and the projections increases in area, relative to conventional structures, because of the concave depressions. Therefore, the adhesive strength between the terminals and the projections also increases, and, when the BCC package is mounted on a next-level circuit board through the terminals, solder joint is also improved in reliability.