A method of making a semiconductor package device includes providing a conductive trace that includes a terminal and a lead, wherein the terminal and the lead are electrically connected to one another, attaching the conductive trace to a semiconductor chip using an insulative adhesive, wherein the chip includes a conductive pad, forming a first insulative housing portion that contacts the chip and the lead without contacting the terminal, wherein the lead protrudes laterally from and extends through the first insulative housing portion, forming a connection joint that contacts and electrically connects the conductive trace and the pad, and forming a second insulative housing portion that contacts the adhesive, the terminal and the first insulative housing portion after forming the first insulative housing portion, wherein the terminal protrudes downwardly from and extends through the second insulative housing portion, and the first and second insulative housing portions form an insulative housing that surrounds the chip.