A light emitting element containing an organic compound has a disadvantage in
that
it tends to be deteriorated by various factors, so that the greatest problem thereof
is to increase its reliability (make longer its life span). The present invention
provides a method for manufacturing an active matrix type light emitting device
and the configuration of such an active matrix type light emitting device having
high reliability. In the method, a contact hole extending to a source region or
a drain region is formed, and then an interlayer insulation film made of a photosensitive
organic insulating material is formed on an interlayer insulation film. The interlayer
insulation film has a curved surface on its upper end portion. Subsequently, an
interlayer insulation film provided as a silicon nitride film having a film thickness
of 20 to 50 nm is formed by a sputtering method using RF power supply.