A hermetically sealed glass package and method for manufacturing the hermetically
sealed glass package are described herein using an OLED display as an example.
Basically, the hermetically sealed OLED display is manufactured by providing a
first substrate plate and a second substrate plate and depositing a frit onto the
second substrate plate. OLEDs are deposited on the first substrate plate. An irradiation
source (e.g., laser, infrared light) is then used to heat the frit which melts
and forms a hermetic seal that connects the first substrate plate to the second
substrate plate and also protects the OLEDs. The frit is glass that was doped with
at least one transition metal and possibly a CTE lowering filler such that when
the irradiation source heats the frit, it softens and forms a bond. This enables
the frit to melt and form the hermetic seal while avoiding thermal damage to the OLEDs.