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The present invention relates to a device having a flexible organic electronic
device comprising in the order listed:
- a) a first flexible composite barrier structure comprising at least
one layer of a first polymeric film and at least one layer of a first barrier material,
the first barrier structure having a first inner surface,
- b) at least one first electrical contact layer,
- c) at least one active layer comprising an organic active material,
said active layer having dimensions defined by a length and a width,
- d) at least one second electrical contact layer,
- e) a second flexible composite barrier structure comprising at least
one layer of a second polymeric film and at least one layer of a second barrier
material, the second barrier structure having a second inner surface,
- wherein at least one of the first and second composite barrier structures
is light-transmitting and the first and second composite barrier structures are
sealed together to envelop the at least one active layer.
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< Flip chip package structure
< Circuit configuration for off-load switching, switch mode power supply, clocked supply, voltage regulator, lamp switch, and methods for operating the circuit configuration
> Method for in-line testing of flip-chip semiconductor assemblies
> Method of sealing two substrates with a non-epoxy or epoxy-acrylate sealant using laser radiation
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~ 00241
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