Provided are a semiconductor die flip chip package with warpage control and fabrication methods for such packages. The packages include heat spreaders that are attached to the die and packaging substrate. In general, the modulus of the adhesive, which is used to attach the heat spreader to the substrate, is selected to provide a relatively "soft" connection. The result is a package with less bowing and so improved co-planarity (e.g., in compliance with industry specifications) with the surface to which it is ultimately bound. Moreover, the die and package reliabilities are thereby enhanced.