A method and system are disclosed for configuring manufacturing tools in a semiconductor manufacturing flow. After collecting information with regard to one or more product performance features associated with a processing step performed in a process tool, one or more undesired process tool performance excursion patterns may be determined based on the collected information. On the other hand, operational and processing parameters of the process tool are monitored while conducting the processing step. Non-conformance faults of the monitored operational and processing conditions are detected and classified. A correlation between the classified non-conformance faults with the determined excursion patterns is made for adjusting one or more processing parameters of the processing tool.