Wafer-level testing is performed on an electronic device to be used in an optical communications system. An optical test signal is generated and is provided to a first photo detector. An electrical output of the first photo detector is supplied to the electronic device on the wafer. An electrical output from the electronic device on the wafer is used to drive a light source. An optical output of the light source is supplied to a second photo detector and an electrical signal output from the second photo detector is examined.

 
Web www.patentalert.com

< Semiconductor chip with bumps and method for manufacturing the same

< Semiconductor device wiring and method of manufacturing the same

> Spatial light modulator with charge-pump pixel cell

> Integrated circuit having negative differential resistance (NDR) devices with varied peak-to-valley ratios (PVRs)

~ 00245