The circuit board connection structure of the invention has a first circuit board and a second circuit board bonded together with a conductive resin layer. The first circuit board has a first terminal region including a plurality of first terminal electrodes arranged in a first direction and a dummy electrode placed next to the first terminal region in the first direction. The second circuit board has a second terminal region including a plurality of second terminal electrodes arranged in the first direction. The second terminal region is placed to face the first terminal region via the conductive resin layer, and the respective second terminal electrodes are electrically connected to the corresponding first terminal electrodes. The conductive resin layer covers at least part of the dummy electrode, and the at least part of the dummy electrode covered with the conductive resin layer has a plurality of openings.