An electrostatic discharge protection apparatus is described. A multi-hole conductive layer is placed between a multi-hole structure and an electronic element of an electronic device. The multi-hole electric conductive layer contacts a conductive layer on the inside surface of a case of the electronic device. It dissipates the electric charges accumulated on the multi-hole structure because of a lack of the conductive layer, and thus prevents the accumulated electric charges from discharging to damage the electronic element.