A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not more than 3.0% by weight, having a modulus of elasticity of 10 MPa or less at a temperature of 250 C. The semiconductor device thus obtained can be free from occurrence of reflow cracks during reflow soldering for the packaging of semiconductor devices.

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< Acrylic polymer and charge transport material

< Quinolone carboxylic acid derivatives

> Process for the oligomerization of -olefins having low unsaturation, the resulting polymers, and lubricants containing same

> Transition metal complexes in the controlled synthesis of polyolefins substituted with functional groups

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