A one-pack moisture-curing epoxy resin composition which can be cured at ordinary
temperatures and is improved in storage stability without impairing the quickness
of curing, i.e., is excellent in two properties incompatible with each other. This
composition includes one ore more members selected from the group consisting of
vinyl carboxylates of the general formula (1) and epoxy-containing silyl compounds
of the general formula (2), one or more members selected from the group consisting
of ketimines and oxazolidines, and an epoxy resin. (1) [In the general formula
(1), R1, R2, R3, and R4 are each independently
hydrogen or an organic group; and n is an integer of 1 or above] (2) [In the general
formula (2), R5 and R6 are each independently alkyl; R7
is an epoxy-containing organic group; and n is an integer of 1 to 3]
##STR1##
