A system and method of coinsurance wafer management. The system includes at least
one production line and an order management unit. The production line processes
a MPW shuttle including original wafers and coinsurance wafers with a common fabrication
process before metal layering, processes the original wafers with different metal
layering fabrication processes according to a metal layering technology of each
device design of the MPW shuttle, and withholds the coinsurance wafers without
further fabrication. The order management unit receives a request for a designated
device design before a cutoff date, and the production line releases and processes
coinsurance wafers with the metal layering fabrication process corresponding to
the designated device design when the request is received.