A hiding layer-forming silicone composition comprising (A) a diorganopolysiloxane comprising structural units of formula (1) and having an average degree of polymerization of at least 50, ##STR1##

wherein R¹ is alkyl or aryl, and R² is alkyl, aryl, alkenyl, alkoxy, alkoxyalkoxy, hydroxyl or epoxy, (B) an organopolysiloxane comprising structural units of formulae (2) and (3):

(R¹—)_n(R²—)_3-nSi—O—  (2)

##STR2##

wherein R¹ and R² are as defined above, n is an integer of 1 to 3, (C) an inorganic powder opacifier, (D) a curing catalyst, and (E) an organic solvent is effectively curable and capable of forming a hiding layer which temporarily adheres well to various substrates of paper, synthetic paper and plastic film while it remains scratchable.