A heat conductive silicone composition comprising (a) an organopolysiloxane having alkenyl groups only at both ends of a molecular chain, (b) a heat conductive filler, (c) an organohydrogenpolysiloxane having Si—H groups only at both ends of a molecular chain, and (d) a platinum group curing catalyst is shaped into an article which conforms to a member and permits heat to dissipate from the member without applying stresses thereto.