A method of metalization of an integrated microsystem. The method comprises providing a substrate and applying a conductive material to the substrate by taking up small aliquots of conductive material and releasing the conductive material onto the substrate to produce a circuit component.

 
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< Electrooptical device and a method of manufacturing the same

< Addressable ptf receptor for iradiated images

> Organic semiconductor devices and methods of fabrication including forming two parts with polymerisable groups and bonding the parts

> Electrically conductive organic compound and electronic device
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