The present invention relates to thermoplastic structures wherein the inner sealant layer of said structure comprises a polyethylene having a density from about 0.88 to about 0.96 and wherein the polyethylene is processed at a temperature ranging from about 150 F. to about 500 F. in order to prevent the release of extractable materials. The thermoplastic structures can be used independently to form a flexible packaging film or can be affixed to a second film structure or substrate to form a flexible packaging film. The flexible packaging films can be used for forming containers for the storing and transporting of organoleptic sensitive products.