A composition and associated method for chemical mechanical planarization
(or other polishing) are described. The composition comprises an
organometallic-modified colloidal abrasive and a nitrogen-containing
polymer compound (e.g., a polyalkyleneimine, such as
polyamidopolyethyleneimine). The composition possesses both high
stability towards gelling and/or solids formation and high selectivity
for metal removal in metal CMP. The composition may further comprise an
oxidizing agent in which case the composition is particularly useful in
conjunction with the associated method for metal CMP applications (e.g.,
copper CMP).