The present invention includes a method of providing a substrate;
sequentially forming a seed layer over the substrate and forming a
protection layer over the seed layer; and sequentially removing the
protection layer and forming a conductor over the seed layer. The present
invention further includes a structure having a substrate, the substrate
having a device; an insulator disposed over the substrate, the insulator
having an opening, the opening disposed over the device; a barrier layer
disposed over the opening; a seed layer disposed over the barrier layer;
and a protection layer disposed over the seed layer.