In the surface acoustic wave device including a lead frame made of metal
in which a plurality of inner leads 9 are formed, wherein a chip 1
comprising at least one piezoelectric substrate is mounted on a resin
base 3 into which a lead frame is molded integrally, are provided a wire
lead section metal surface 7a that is formed by exposing a wire lead
section 7, which is electrically connected with an electrode of the chip
through a bonding wire 4, out of inner leads that are arranged on both
sides of the chip, from the resin base, and a chip lead section metal
surface 10a that is formed by exposing a chip lead section 10, which is
partially covered with the chip, from the resin base.