A liquid epoxy resin composition is provided comprising (A) a liquid epoxy resin, (B) an optional curing agent, (C) a curing accelerator, (D) an inorganic filler, and (E) acrylic submicron particles of core-shell structure formed of polymers or copolymers comprising an alkyl acrylate and/or alkyl methacrylate as a monomeric component, the core having a Tg of up to -10.degree. C., the shell having a Tg of 80-150.degree. C. The composition is adherent to surfaces of silicon chips, especially polyimide resins and nitride film and useful as sealant for flip chip type semiconductor devices.