A polymer comprising recurring units having a partial structure of formula
(1) wherein R.sup.1 is a single bond or alkylene or fluoroalkylene,
R.sup.2 and R.sup.3 are H or alkyl or fluoroalkyl, at least one of
R.sup.2 and R.sup.3 contains at least one fluorine atom is used as a base
resin to formulate a resist composition which has advantages including
high transparency to radiation having a wavelength of up to 200 nm,
substrate adhesion, developer affinity and dry etching resistance
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