Each of junctions formed between a semiconductor device and a substrate comprises metal balls of Cu etc. and compounds of Sn and the metal balls, and the metal balls are bonded together by the compounds.

 
Web www.patentalert.com

< Self-reactive/curable water-based solid adhesive and method of bonding with the self-reactive/curable water-based solid adhesive

< Block copolymer hot-melt processable adhesives, methods of their preparation, and articles therefrom

> Pigment dispersing agent, pigment composition containing the same and pigment dispersion containing the same

> System and method for capturing video frames for focused navigation within a user interface
~ 00279