A semiconductor device includes a first semiconductor package, in which a first semiconductor chip is mounted and a second semiconductor package, in which a second semiconductor chip is mounted and which is supported above the first semiconductor package so as to extend off the first semiconductor package.

 
Web www.patentalert.com

< Artificial intelligence system for track defect problem solving

< Test substrate reclamation method and apparatus

> Zeolite films for low k applications

> System and method for hydrogen-rich selective oxidation

~ 00281