An exemplary embodiment discloses a process for cleaning semiconductor
fabrication equipment parts with non-metallic surfaces. The process
optionally includes providing a semiconductor fabrication part with a
non-metallic surface to be cleaned and applying a dilute aqueous solution
to remove contamination from the non-metallic surface. The aqueous
solution optionally includes dilute amounts of hydrofluoric acid, nitric
acid and hydrogen peroxide. The dilute amounts would optionally be in the
ranges of 0.5-1.5% wt. hydrofluoric acid, 0.1-0.5%wt. nitric acid and
1-10%wt. hydrogen peroxide.