In accordance with the present invention, an aperture rectenna is provided
where the substrate is transparent and of sufficient mechanical strength
to support the fabricated structure above it. An aperture antenna is
deposited on the transparent substrate and a metal-insulator-metal (MIM)
diode is constructed on top of the aperture antenna. There is an
insulating layer between the aperture antenna metal and the metal ground
plane optimized to maximize the collection of incident radiation. The top
of the structure is capped with a metal ground plane layer, which also
serves as the DC connection points for each rectenna element.