A heat pipe cooling device includes a heat conductor base, heat pipes and a cooling body. The heat conductor base further includes a base with multiple trenches and an upper cover. The heat pipes include a heat reception end and a cooling end. When the heat reception end of the heat pipes is contained in the trenches of the base, the bottom portion of the heat reception end tightly contacts the trenches. The upper cover includes multiple through holes and compressive portions formed between each pair of the through holes. The upper cover and the base are then tightly combined. The cooling end of the heat pipe penetrates the through hole. The compressive portion between the through holes is securely affixed above the heat reception end of the heat pipes. A cooling body is connected to the cooling end of the heat pipe, thereby forming the heat pipe cooling device.