A method of forming a rhenium layer on a substrate, comprising: applying a solid rhenium-containing compound to a substrate; reducing at a temperature above ambient temperature the rhenium-containing compound so that a rhenium layer is formed on the substrate; and optionally, repeating applying additional rhenium-containing compound on at least a section of the rhenium layer, and reducing at a temperature above ambient temperature the additional rhenium-containing compound so that a thicker layer of rhenium is formed.