A wafer transfer apparatus having two independently movable transfer modules. The apparatus that transfers the wafers from one chamber to another includes a first transfer module and a second transfer module. Each module has a robot arm and at least one blade. Each robot arm freely rotates along the chambers, and each blade is rotatably connected to the robot arm. The first and second transfer modules move independently in same or different directions. Each transfer module may have two blades, which are joined respectively to upper and lower parts of the robot arm. Furthermore, the first and second transfer modules can maintain an angle of at least one hundred twenty degrees, whereby preventing the wafers from being overlapped in transit.