Heat sink structures employing carbon nanotube or nanowire arrays to reduce the thermal interface resistance between an integrated circuit chip and the heat sink are disclosed. Carbon nanotube arrays are combined with a thermally conductive metal filler disposed between the nanotubes. This structure produces a thermal interface with high axial and lateral thermal conductivities.

 
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< Methods for producing composites of single-wall carbon nanotubes and compositions thereof

< Nanotubes for integrated circuits

> Transistor with nanocrystalline silicon gate structure

> Fullerene derivatives

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