A mask pattern correction method capable of preventing a position of a
pattern from deviating by deformation of a mask due to gravity, a mask
production method, a mask, and a production method of a semiconductor
device capable of forming a fine pattern with high accuracy are provided.
A mask pattern correction method, a mask production method, a mask
produced thereby and a production method of a semiconductor device using
the mask include a step of creating first position data indicating
positions of a plurality of marks when supporting a first thin film
having the marks in a state where a first surface directs upward, a step
of creating second position data indicating mark positions when
supporting the first thin film in a state where a second surface directs
upward, a step of obtaining a transfer function for converting the first
position data to the second position data, and a step of correcting a
mask pattern as a shape of exposure beam transmission portions formed on
a second thin film by using an inverse function of the transfer function.