A microelectronic package includes a microelectronic element having contacts accessible at a surface thereof, a layer overlying the microelectronic element, the layer having a first surface and a sloping peripheral edge extending away from the first surface of the layer, and conductive terminals overlying the microelectronic element, wherein the layer supports the conductive terminals over the microelectronic element. The package also includes conductive traces having first ends electrically connected with the contacts of the microelectronic element and second ends electrically connected with the conductive terminals, with at least one of the conductive traces having a section that is in contact with and extends along the sloping peripheral edge of the layer, and a compliant material disposed between the conductive terminals and the microelectronic element so that the conductive terminals are movable relative to the microelectronic element.