A semiconductor device is provided, the semiconductor device including a semiconductor chip having a first metal heat-conductive medium in the inside thereof, a substrate having a second metal heat-conductive medium thermally connected to the first metal heat-conductive medium, and a temperature control device of which at least a part is disposed on the substrate, thermally connected to the second metal heat-conductive medium, and configured to control the temperature within the semiconductor chip.

 
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< Microelectronic assemblies having compliant layers

< Structures and methods for heat dissipation of semiconductor integrated circuits

> System, method and apparatus for improved electrical-to-optical transmitters disposed within printed circuit boards

> Semiconductor device having an alignment mark formed by the same material with a metal post
~ 00288