A tape head comprised of a substrate and a closure coupled to the substrate. Read and/or write elements are embedded in the substrate. Contact pads are coupled to the substrate, the pads being in electrical communication with the read and/or write elements. At least one lapping element is embedded in the substrate. Supplemental pads are coupled to the substrate, the supplemental pads being in electrical communication with at least one lapping element. A tape head according to another embodiment includes a substrate, a patterned (e.g. generally U-shaped, rectangular, etc.) closure formed on the substrate, read and/or write elements embedded in the substrate, and two rows of contact pads coupled to the substrate, the pads being in electrical communication with the read and/or write elements.