A method for providing main power inductance to a switching power supply using bond wires of an integrated circuit packaging. A predetermined number of bond wires are connected serially between standalone die bond pads and no-connect pins of the packaging. An output of the switching power supply is connected to a first bond wire, and an output pin of the integrated circuit is connected to a last bond wire. A number of the bond wires, a length and a diameter of each bond wire, and a distance of the bond wires from a die attach paddle may be pre-selected to determined the main power inductance.