The invention relates to a process for the control of the position of workpiece and tool with a robot in a production machine. The objective of the invention is to reduce non-productive secondary processing time during the processing or measuring of a workpiece with a robot. The invention consists of a process for the control of the position of workpiece and tool with a robot in a production machine in which the workpiece (10) is positioned relative to the tool (1), (2) and during a continuous movement of the workpiece (10) with a tool (1), (2) at the processing location of the workpiece (10) a process takes place, and the tool (1), (2) is moving during the process synchronously to and in the same direction like the workpiece (10) and during the continuous movement of the workpiece (10) the tool (1), (2) is moved to and positioned in another processing location.

 
Web www.patentalert.com

> Wafer protection system

~ 00302